Intel® Xeon® Processor Scalable Family, Single Socket P (LGA 3647) supported, CPU TDP support 205W Intel® C622 chipset Up to 1TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 8x DIMM slots Expansion slots: 1 PCI-E 3.0 x16, 1 PCI-E 3.0 x16 (x16 || x8), 1 PCI-E 3.0 x8 (x0 || x8), 1 PCI-E 3.0 x8, 1 PCI-E 3.0 x4 (in x8) 2 10GbE LAN ports 10 SATA3 (6Gbps) via C622 I/O: 1 VGA, 2 COM, TPM header 2 SuperDOM with built-in power 5 USB 3.0 (2 rear, 1 Type-A, 2 via header), 6 USB 2.0 (2 rear, 4 via headers) M.2 NGFF connector
Specifications
Processor
Processor manufacturer
Intel
Thermal power
205
W
Memory
Supported memory types
DDR4-SDRAM
Supported memory clock speeds
1600,1866,2133,2400,2666
MHz
Number of DIMM slots
8
Maximum internal memory
1000
GB
Supported DIMM module capacities
4GB,8GB,16GB,32GB,64GB,128MB
ECC
Memory voltage
1.2
V
Storage controllers
RAID levels
0,5,10
Internal I/O
USB 2.0 connectors
6
Back panel I/O ports
USB 2.0 ports quantity
6
USB 3.0 (3.1 Gen 1) Type-A ports quantity
5
COM ports quantity
2
VGA (D-Sub) ports quantity
1
Features
Motherboard form factor
ATX
Trusted Platform Module (TPM)
Networking
Ethernet LAN
Ethernet interface type
10 Gigabit Ethernet
Wi-Fi
Expansion slots
PCI Express x4 (Gen 3.x) slots
1
PCI Express x8 (Gen 3.x) slots
1
PCI Express x16 (Gen 3.x) slots
1
BIOS
BIOS type
UEFI AMI
ACPI version
6.0
Operational conditions
Operating temperature (T-T)
0 - 50
°C
Storage temperature (T-T)
-40 - 70
°C
Operating relative humidity (H-H)
8 - 90
%
Storage relative humidity (H-H)
5 - 95
%
Weight & dimensions
Width
304.8
mm
(11.89 ")
Depth
243.8
mm
(9.51 ")
Note:
Please be aware that availability, promotions, and descriptions may change without notice, but you can feel confident knowing that the price for
MBD-X11SPI-TF-O by Supermicro
you see now, is the price you pay. If you have any questions, our customer care team is available to assist you.