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| CAS latency | 40 |
| Internal memory | 128 GB |
| Internal memory type | DDR5 |
| Memory clock speed | 5600 MHz |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| Memory voltage | 1.25 V |
| ECC | |
| Lead plating | Gold |
| Module configuration | 4096M x 64 |
| Refresh row cycle time | 295 ns |
| Row cycle time | 48 ns |
| Row active time | 32 ns |
| Programming power voltage (VPP) | 1.8 V |
| SPD voltage | 1.1 V |
| SPD Latency | 39 |
| SPD profile | |
| SPD speed | 4800 MHz |
| Intel Extreme Memory Profile (XMP) | |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Memory channels | Quad-channel |
| Memory layout (modules x size) | 4 x 32 GB |
| Memory ranking | 2 |
| On-Die ECC | |
| Buffered memory type | Unregistered (unbuffered) |
| Cooling type | Heatsink |
| Product colour | Black |
| JEDEC standard |
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Width | 6.6 mm (0.26 ") |
| Depth | 133.4 mm (5.2 ") |
| Height | 34.8 mm (1.36 ") |
| Weight | 154.27 g (0.34 lbs) |
| Package type | Blister |
| Package width | 95.3 mm |
| Package depth | 25.4 mm |
| Package height | 171.5 mm |
| Package weight | 201.99 g |
| Master carton width | 203.2 mm |
| Master carton length | 311.2 mm |
| Master carton height | 101.6 mm |
| Master carton weight | 2231.78 g |
| Quantity per master carton | 10 pc(s) |
| Country of origin | China, Taiwan |
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